AT24C02 |
RFQ for AT24C02 Required Field |
 |
| Technical/Catalog Information | AT24C02-10PC |
| Vendor | Atmel |
| Category | Integrated Circuits (ICs) |
| Memory Type | EEPROM |
| Memory Size | 2K (256 x 8) |
| Speed | 400kHz |
| Interface | I²C, 2-Wire Serial |
| Package / Case | 8-DIP |
| Packaging | Tube |
| Voltage - Supply | 4.5 V ~ 5.5 V |
| Operating Temperature | 0°C ~ 70°C |
| Format - Memory | EEPROMs - Serial |
| Drawing Number | * |
| Lead Free Status | Contains Lead |
| RoHS Status | RoHS Non-Compliant |
| Other Names | AT24C02 10PC AT24C0210PC |
| Product | Manufacturers | Pack | D/C |
| AT24C02 | Atmel | - | - |
The AT24C01A/02/04/08A/16A provides 1024/2048/4096/8192/16384 bits of serial electrically erasable and programmable read-only memory (EEPROM) organized as 128/256/512/1024/2048 words of 8 bits each. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. The AT24C01A/02/04/08A/16A is available in space-saving 8-lead PDIP, 8 lead JEDEC SOIC, 8-lead MAP, 5-lead SOT23 (AT24C01A/AT24C02/AT24C04), 8- lead TSSOP, and 8-ball dBGA2 packages and is accessed via a Two-wire serial inter- face. In addition, the entire family is available in 2.7V (2.7V to 5.5V) and 1.8V (1.8V to 5.5V) versions.
Features |
| Low-voltage and Standard-voltage Operation 2.7 (VCC= 2.7V to 5.5V) 1.8 (VCC= 1.8V to 5.5V) Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K), 1024 x 8 (8K) or 2048 x 8 (16K) Two-wire Serial Interface Schmitt Trigger, Filtered Inputs for Noise Suppression Bidirectional Data Transfer Protocol 100 kHz (1.8V) and 400 kHz (2.7V, 5V) Compatibility Write Protect Pin for Ha rdware Data Protection 8-byte Page (1K, 2K), 16-byte Page (4K, 8K, 16K) Write Modes Partial Page Writes Allowed Self-timed Write Cycle (5 ms max) High-reliability Endurance: 1 Million Write Cycles Data Retention: 100 Years Automotive Grade and Lead-free/Ha logen-free Devices Available 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead MAP, 5-lead SOT23, 8-lead TSSOP and 8-ball dBGA2 Packages Die Sales: Wafer Form, Waffle Pack and Bumped Wafers |
